Height inspection of BGA solder balls and bumps.
Concept of height inspection for BGA solder balls and bumps.
The height of BGA solder balls and bumps cannot be determined from 2D images; 3D measurements are required. What can be seen in 2D are the presence or absence of balls, positional shifts, sizes, and dirt. Since the balls are small and shine like mirrors, the basic method is to illuminate them from multiple directions in sequence and connect the readable spots. 【Points】 ■ The presence and position of the balls are viewed in 2D, while height alignment is assessed in 3D. ■ The apex of the balls is prone to reflection, making it unreadable with light from just one direction. ■ Gaps between the balls may remain as areas that cannot be measured. *For detailed explanations, please refer to the technical notes and downloadable materials in the related links.
- Company：浅原技研 岐阜本社
- Price：Other
